As semiconductor technology continues to evolve, contamination control becomes increasingly critical. Smaller chip geometries, new deposition processes and more aggressive process media create new challenges throughout the semiconductor supply chain.
For a leading semiconductor OEM, these developments introduced a complex challenge. Existing hose solutions could no longer provide the required combination of corrosion resistance, ultra-high purity cleanliness levels and serviceability.
In this CoreCase, we take a closer look at how CoreDux developed and validated a new Ultra High Purity (UHP) hose solution, combining Alloy 22 material expertise with advanced contamination control capabilities to support next-generation deposition processes.
The challenge: controlling contamination in aggressive deposition environments
Within modern semiconductor manufacturing, contamination is one of the most critical risks affecting wafer yield. As chip manufacturers continue to reduce transistor sizes, even microscopic particles can result in defects, yield losses and reduced process performance.
At the same time, new deposition processes increasingly rely on more aggressive process media. While conventional stainless steel hose solutions may perform adequately in many applications, these new environments place significantly higher demands on corrosion resistance and cleanliness performance.
For the semiconductor OEM involved in this project, existing solutions were unable to consistently meet the required cleanliness levels while also providing sufficient resistance against corrosion caused by aggressive process gases and elevated temperatures. The result was a clear need for a new approach capable of addressing both challenges simultaneously.