CoreCase: a new UHP hose solution for semiconductor manufacturing

Welcome to the latest CoreCase

As semiconductor technology continues to evolve, contamination control becomes increasingly critical. Smaller chip geometries, new deposition processes and more aggressive process media create new challenges throughout the semiconductor supply chain.

For a leading semiconductor OEM, these developments introduced a complex challenge. Existing hose solutions could no longer provide the required combination of corrosion resistance, ultra-high purity cleanliness levels and serviceability.

In this CoreCase, we take a closer look at how CoreDux developed and validated a new Ultra High Purity (UHP) hose solution, combining Alloy 22 material expertise with advanced contamination control capabilities to support next-generation deposition processes.

 

The challenge: controlling contamination in aggressive deposition environments

Within modern semiconductor manufacturing, contamination is one of the most critical risks affecting wafer yield. As chip manufacturers continue to reduce transistor sizes, even microscopic particles can result in defects, yield losses and reduced process performance.

At the same time, new deposition processes increasingly rely on more aggressive process media. While conventional stainless steel hose solutions may perform adequately in many applications, these new environments place significantly higher demands on corrosion resistance and cleanliness performance.

For the semiconductor OEM involved in this project, existing solutions were unable to consistently meet the required cleanliness levels while also providing sufficient resistance against corrosion caused by aggressive process gases and elevated temperatures. The result was a clear need for a new approach capable of addressing both challenges simultaneously.

Semicon

Why contamination becomes more critical with every new chip generation

Semiconductor manufacturing operates at a scale that is difficult to comprehend. Modern chips are produced using structures measured in only a few nanometers. At these dimensions, particles that are thousands of times smaller than the thickness of a human hair can already impact process performance.

As a result, contamination control extends far beyond simple cleaning procedures. Materials, manufacturing processes, handling methods and supplier capabilities all influence the cleanliness of the final product.

In advanced deposition processes, corrosion introduces an additional risk. When hose materials begin to degrade, corrosion particles can enter the process environment and ultimately affect wafer production. For semiconductor manufacturers, contamination and corrosion are therefore closely connected challenges that must be addressed together.

Combining corrosion resistance and UHP cleanliness

To address the customer’s requirements, CoreDux developed a new UHP hose solution based on Alloy 22, a high-performance nickel-chromium alloy specifically selected for its superior corrosion resistance.

Compared to conventional 316L stainless steel solutions, Alloy 22 offers significantly improved resistance against aggressive media used in modern deposition processes. At the same time, CoreDux combined this material expertise with advanced electropolishing capabilities and validated UHP cleaning processes to achieve the required cleanliness levels.

The project required more than selecting a new material. Every aspect of manufacturing, cleaning, validation and quality control had to be carefully aligned to ensure that both corrosion resistance and contamination control requirements could be achieved.

For the customer, this resulted in a solution capable of supporting demanding deposition environments while maintaining the cleanliness levels required for semiconductor manufacturing.

Strategic value for semiconductor manufacturers

Beyond the technical solution itself, the project delivers strategic value for semiconductor manufacturers facing increasingly demanding process requirements.

Historically, many systems relied on rigid tube solutions to minimize contamination risks. While effective from a cleanliness perspective, these systems often create challenges during maintenance and servicing activities. Components must be disconnected, cleaned and revalidated, increasing downtime and operational complexity.

By introducing a flexible UHP hose solution that combines validated cleanliness levels with corrosion resistance, CoreDux enables customers to maintain process integrity while improving serviceability and reducing maintenance effort.

The result is a solution that supports both operational efficiency and long-term process reliability.

The CoreDux approach

From the earliest technical discussions, CoreDux worked closely with the customer to understand the specific challenges within the deposition process.

The project focused on identifying the root causes of contamination risks, evaluating material limitations and defining the cleanliness levels required for successful implementation.

Rather than relying solely on existing portfolio solutions, CoreDux adopted an innovation-driven approach. The organization invested in developing new manufacturing methods, validating new materials and refining cleaning processes to meet the customer’s requirements.

This collaborative process enabled the development of a hose solution specifically tailored to the needs of next-generation semiconductor manufacturing.

Developing a new generation of UHP hose solutions

One of the key challenges was introducing Alloy 22 into a hose manufacturing process that requires complex forming operations and strict quality control.

Different materials respond differently during production. Developing a reliable manufacturing process therefore required extensive collaboration between engineering, operations, process engineering and quality teams across multiple CoreDux locations.

At the same time, UHP cleanliness requirements demanded a fully integrated contamination control strategy. Cleanliness validation, cleanroom manufacturing, supplier awareness and process discipline all played a critical role in achieving the final result.

The project demonstrates how material expertise, contamination control knowledge and manufacturing capabilities must work together to successfully deliver solutions for advanced semiconductor applications.

A validated solution for next-generation deposition processes

The newly developed UHP hose solution has successfully passed customer validation and is approved for production deployment.

By combining Alloy 22 corrosion resistance, advanced electropolishing capabilities and validated UHP cleanliness levels, CoreDux successfully supported the customer’s next-generation deposition process requirements.

The project also reinforces CoreDux’ position as a partner capable of delivering highly specialized semiconductor solutions through material expertise, contamination control knowledge and vertically integrated manufacturing.

As semiconductor technologies continue to evolve, the ability to control both contamination and corrosion will only become more important. Through continuous investment in manufacturing capabilities, cleanroom technologies and process innovation, CoreDux continues to support customers operating at the highest levels of semiconductor performance.

 

Do you want to know more about this project or what we can do for you? Feel free to contact us.

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